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AGC Expands Fluon+ EA-2000 Resin Production

Used in high-frequency printed circuit boards.

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By: Anthony Locicero

Copy Editor, New York Post, Rodman Media

AGC is significantly expanding its production capacity of Fluon+ EA-2000 fluorinated resin by establishing a new facility at its plant in Chiba, Japan. 

 
Fluon+ EA-2000 is primarily used as a material for 5G high-speed, high-frequency printed circuit boards, which will see a sharp increase in demand as 5G network technology becomes widely available by 2020. 
 
Operation of AGC’s new Fluon+ EA-2000 production facility will begin in September 2019.

Fluon+ EA-2000 is ideal for coating and protecting printed circuit boards because it provides enhanced electrical characteristics. For example, the production of the copper-clad laminate, a material used in printed circuit boards for 5G applications with high-frequency bands, requires materials that exhibit low transmission losses. When used in printed circuit boards Fluon+ EA-2000 can reduce transmission losses at 28 GHz by more than 30% compared to existing materials.

Because of the remarkably low transmission losses of Fluon+ EA-2000, it can be applied in both flexible and rigid CCL for use in a wide variety of printed circuit boards, including those for smartphones and other mobile devices, base stations, servers and automotive equipment.

Fluon+ EA-2000 PFA resin features a built-in functional adhesive group that enables one-step processing with other polymers and metals. It also eliminates the need for surface treatment or a separate adhesive layer. It is heat resistant to 260°C and features superior chemical resistance, equivalent to conventional PFA materials. It also exhibits excellent non-stick properties, low frictional properties, water and oil repellency, a low dielectric constant and low dissipation factor.

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